TSMC Launches Automotive Process Qualification Specification and Service Package in China MarketTSMC Commits to China Automotive Excellence by Meeting AEC Guidelines HSINCHU, Taiwan, November 27 - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) Additional Detail Regarding TSMC Expects Next Year to be a Record YearHSINCHU, Taiwan, R.O.C. - At TSMC’s third quarter investors’ conference on October 29, TSMC Chairman Dr. Morris Chang commented that “For TSMC, we expect next year to be a record year.” TSMC Spokesperson and Chief Financial Officer Ms. Lora Ho provides additional detail regarding this statement. TSMC Adds High-K Metal Gate Low Power Process to 28nm Road MapHSINCHU, Taiwan, R.O.C. - - Risk production expected in Q3 2010 Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010. TSMC Achieves 28nm SRAM Yield BreakthroughHSINCHU, Taiwan, R.O.C. - - Key process development achievement demonstrates gate-last approach manufacturing benefits TSMC Extends Design Methodology Leadership to 28nm With Reference Flow 10.0HSINCHU, Taiwan - - Introduces SiP design solutions for the first time and continues to drive differentiated features in power, performance and DFM TSMC Launches Unified Physical Verification Format for Advanced Process TechnologiesHSINCHU, Taiwan, R.O.C. - - New iDRC and iLVS Data Formats Ensure Data Accuracy and Enable Extensive EDA Support of Physical Verification Related Applications in TSMC 40nm Process TSMC Launches First Advanced Technology Interoperable Process Design KitHSINCHU, Taiwan, R.O.C. - - Industry-Wide Collaborative Development Effort Delivers First Unified iPDK for 65nm Process NetLogic Microsystems and TSMC Collaborate on Industry-Leading 40nm Technology for Next-Generation Knowledge-based Processors and 10/40/100 Gigabit Physical Layer SolutionsMOUNTAIN VIEW, California and HSINCHU, Taiwan, R.O.C. - - NetLogic Microsystems Successfully Migrates Multiple Product Lines to TSMC’s Advanced 40nm Technology Node to offer customers significantly higher performance, lower power consumption and advanced features that enable next-generation networking, communications, data center, security and storage applications NXP and TSMC Deliver Industry’s First 45nm Single-Chip Digital TV PlatformEINDHOVEN, The Netherlands and HSINCHU, Taiwan, R.O.C. - - Accelerates TV set development; dramatically reduces cost of production TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory TechnologyHSINCHU, Taiwan - - Provides greater design flexibility and higher performance Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the foundry segment’s first functional 65-nanometer (nm) multi-time programmable (MTP) non-volatile memory (NVM) process technology. The technology incorporates process-qualified MTP IP blocks jointly developed with Virage Logic. The new technology is the first 2.5 volt MTP process, breaking the heretofore 3.3 volt baseline barrier. It eliminates the need for an external EEPROM currently in many systems applications, thereby reducing power, area and costs while increasing data security. TSMC Enhances 0.13-micron FamilyHSINCHU, Taiwan, R.O.C. - - Area reduction and performance gain with slim platform for analog and power management system-on-chip applications Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process TechnologyTOKYO and HSIN-CHU, Taiwan - Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they will collaborate on leading-edge process technology production for the manufacturing of Fujitsu Microelectronics’ products. Under an agreement between the companies, Fujitsu Microelectronics will expand its 40-nanometer generation logic IC business with production at TSMC’s fabs. TSMC Launches Integrated Sign-Off Flow to Shorten Design Cycle, Enhance Tape-Out QualityHSINCHU, Taiwan - Open Innovation Platform Drives First Comprehensive and Executable RTL To GDSII Design Flow TSMC Announces Foundry’s First Mixed Signal/RF Reference Design KitHSINCHU, Taiwan - Silicon-proven Reference Design Approach Accelerates RF Designs and Enables Systems-on-Chip Integration |
