Additional Detail Regarding TSMC Expects Next Year to be a Record Year

HSINCHU, Taiwan, R.O.C. -

At TSMC’s third quarter investors’ conference on October 29, TSMC Chairman Dr. Morris Chang commented that “For TSMC, we expect next year to be a record year.” TSMC Spokesperson and Chief Financial Officer Ms. Lora Ho provides additional detail regarding this statement.

TSMC Adds High-K Metal Gate Low Power Process to 28nm Road Map

HSINCHU, Taiwan, R.O.C. -

- Risk production expected in Q3 2010

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010.

TSMC Achieves 28nm SRAM Yield Breakthrough

HSINCHU, Taiwan, R.O.C. -

- Key process development achievement demonstrates gate-last approach manufacturing benefits

TSMC Launches Unified Physical Verification Format for Advanced Process Technologies

HSINCHU, Taiwan, R.O.C. -

- New iDRC and iLVS Data Formats Ensure Data Accuracy and Enable Extensive EDA Support of Physical Verification Related Applications in TSMC 40nm Process

TSMC Launches First Advanced Technology Interoperable Process Design Kit

HSINCHU, Taiwan, R.O.C. -

- Industry-Wide Collaborative Development Effort Delivers First Unified iPDK for 65nm Process

NetLogic Microsystems and TSMC Collaborate on Industry-Leading 40nm Technology for Next-Generation Knowledge-based Processors and 10/40/100 Gigabit Physical Layer Solutions

MOUNTAIN VIEW, California and HSINCHU, Taiwan, R.O.C. -

- NetLogic Microsystems Successfully Migrates Multiple Product Lines to TSMC’s Advanced 40nm Technology Node to offer customers significantly higher performance, lower power consumption and advanced features that enable next-generation networking, communications, data center, security and storage applications

NXP and TSMC Deliver Industry’s First 45nm Single-Chip Digital TV Platform

EINDHOVEN, The Netherlands and HSINCHU, Taiwan, R.O.C. -

- Accelerates TV set development; dramatically reduces cost of production

TSMC Enhances 0.13-micron Family

HSINCHU, Taiwan, R.O.C. -

- Area reduction and performance gain with slim platform for analog and power management system-on-chip applications

TSMC Qualifies New 0.18-Micron Embedded Flash Family

HSIN-CHU, Taiwan, R.O.C. - Ideal for power sensitive, automotive and analog applications

Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330; NYSE: TSM)
today announced that it has qualified its new 0.18-micron embedded flash
(embFlash) process technology family that targets a wide range of
applications. The new family includes a baseline 1.8 to 5 volt standard
process, an ultra-low leakage process, and specific automotive-qualified
embedded Flash IP.

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