Additional Detail Regarding TSMC Expects Next Year to be a Record YearHSINCHU, Taiwan, R.O.C. - At TSMC’s third quarter investors’ conference on October 29, TSMC Chairman Dr. Morris Chang commented that “For TSMC, we expect next year to be a record year.” TSMC Spokesperson and Chief Financial Officer Ms. Lora Ho provides additional detail regarding this statement. TSMC Adds High-K Metal Gate Low Power Process to 28nm Road MapHSINCHU, Taiwan, R.O.C. - - Risk production expected in Q3 2010 Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010. TSMC Achieves 28nm SRAM Yield BreakthroughHSINCHU, Taiwan, R.O.C. - - Key process development achievement demonstrates gate-last approach manufacturing benefits TSMC Extends Design Methodology Leadership to 28nm With Reference Flow 10.0HSINCHU, Taiwan - - Introduces SiP design solutions for the first time and continues to drive differentiated features in power, performance and DFM TSMC Launches Unified Physical Verification Format for Advanced Process TechnologiesHSINCHU, Taiwan, R.O.C. - - New iDRC and iLVS Data Formats Ensure Data Accuracy and Enable Extensive EDA Support of Physical Verification Related Applications in TSMC 40nm Process TSMC Launches First Advanced Technology Interoperable Process Design KitHSINCHU, Taiwan, R.O.C. - - Industry-Wide Collaborative Development Effort Delivers First Unified iPDK for 65nm Process TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory TechnologyHSINCHU, Taiwan - - Provides greater design flexibility and higher performance Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the foundry segment’s first functional 65-nanometer (nm) multi-time programmable (MTP) non-volatile memory (NVM) process technology. The technology incorporates process-qualified MTP IP blocks jointly developed with Virage Logic. The new technology is the first 2.5 volt MTP process, breaking the heretofore 3.3 volt baseline barrier. It eliminates the need for an external EEPROM currently in many systems applications, thereby reducing power, area and costs while increasing data security. TSMC Enhances 0.13-micron FamilyHSINCHU, Taiwan, R.O.C. - - Area reduction and performance gain with slim platform for analog and power management system-on-chip applications MediaTek Introduced MT7110 Series WiMAX SoC — the Highest Integrated WiMAX Chips for CPEs, Handsets, and other Mobile DevicesHSINCHU, Taiwan - MediaTek (Taiwan Stock Exchange: 2454), a worldwide leader in wireless and consumer electronics SoCs today announces three second generation IEEE 802.16e WiMAX chips. MT7110 series are fully compliant with, and provide more features and performance than WiMAX Forum Wave2 specifications. These chips are intended to revolutionalize the market and take the industry to the next level of mass market adoption. MediaTek MT7118, the Best SoC Choice for the Most Cost Effective WiMAX + GSM Dual Mode Handsets and Embedded DevicesHSINCHU, Taiwan - MediaTek (Taiwan Stock Exchange: 2454), a worldwide leader in wireless and consumer electronics SoCs today announces a new WiMAX Forum Wave2 chip, MT7118 for USB dongles, handsets, and other embedded devices. Announced at the same time is a prototype of low cost WiMAX and GSM EDGE dual mode phone, produced by a MediaTek handset partner. This is the first WiMAX phone design supported by a leading cellular chip vendor. This design is based on MediaTek WiMAX chip and world leading MediaTek EDGE baseband processor. TSMC Launches Unified Interconnect Modeling Format for Advanced Process TechnologiesHSINCHU, Taiwan - New iRCX Format Ensure Data Accuracy and Enables Extensive EDA Support of Interconnect Modeling Related Applications in TSMC 65nm and 40nm TSMC Launches Integrated Sign-Off Flow to Shorten Design Cycle, Enhance Tape-Out QualityHSINCHU, Taiwan - Open Innovation Platform Drives First Comprehensive and Executable RTL To GDSII Design Flow TSMC Announces Foundry’s First Mixed Signal/RF Reference Design KitHSINCHU, Taiwan - Silicon-proven Reference Design Approach Accelerates RF Designs and Enables Systems-on-Chip Integration |
