MediaTek and Qualcomm Enter Into Patent Arrangement

SAN DIEGO and HSINCHU, Taiwan, November 19 - Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator
of advanced wireless technologies, products and services, and MediaTek, Inc.,
(TPE: 2454), a leading fabless semiconductor company for wireless
communications and digital multimedia solutions, today announced that they
have entered into a broad patent arrangement under each company's patent
portfolios, including CDMA and WCDMA essential patents, with respect to all
integrated circuit products, including CDMA and WCDMA products.

NXP Semiconductors Announces a Live Webinar: Lowest Cost ARM9 with High Speed USB 2.0 OTG Performance for Management of USB Connectivity

SAN JOSE, California, November 17 - NXP Semiconductors announces the following TechOnline Webinar:

Gigle Semiconductor Changes Name to Gigle Networks

New Name Reflects Home-Networking Innovator's Expanded Focus Beyond Silicon to Include Advanced Network Capabilities

Gigle Networks Names Andreas Melder Vice President of Business Development

Industry Veteran Brings Substantial Experience in Executing Pre-IPO Growth Initiatives at Companies Including Intellon and Microtune

Synopsys and King Abdulaziz City of Science and Technology (KACST) Sign Agreement to Promote Knowledge-Based Society in Saudi Arabia

RIYADH, Saudi Arabia, November 14 - Synopsys, Inc., a world leader in software and IP for semiconductor
design, verification and manufacturing and KACST, the King Abdulaziz City of
Science and Technology in Saudi Arabia, today signed an agreement to work
together to promote a knowledge-based society in The Kingdom of Saudi Arabia.
The arrangement enables the two organizations to establish a Center of
Excellence for Nanoelectronic Design at KACST in Riyadh, featuring a
nanotechnology and nanoelectronics infrastructure, state-of-the-art computing
environment, a Synopsys-based electronic design environment and
nanoelectronics design flow, advanced training and experienced staff from
Synopsys or trained by Synopsys.

MarketsandMarkets Smart Homes and Assisted Living Analyst Briefing to be Held on 2nd Dec 2009

WILMINGTON, Delaware, November 12 - The Semiconductor and Electronics practice at
MarketsandMarkets (www.marketsandmarkets.com/) is pleased to announce
its Analyst Briefing Presentation on the Smart Homes and Assisted Living -
Advanced Technologies and Global Market to be held on 2nd Dec 2009.

LPKF Raises Forecast for 2009

GARBSEN, Germany, November 10 - Company performance

Freescale Semiconductor Appoints ATREG as Advisor for Two Operational Fab Sales

SEATTLE -

ATREG, the semiconductor division of Colliers International, announced their formal appointment as advisor to Freescale Semiconductor, in the sale of two of Freescale’s operational 150mm semiconductor manufacturing facilities. The automotive qualified analog fab offerings are located in Toulouse, France and Sendai, Japan, and include complete process tool lines and wafer supply agreements.

Marketsandmarkets: Global Electroactive Polymers Product Market Worth US$2.78 Billion By 2014

WILMINGTON, Delaware - According to a new market research report, ‘Global Electroactive Polymers Market (2009 - 2014)’, published by MarketsandMarkets (www.marketsandmarkets.com), the global electroactive polymers product market is expected to be worth US$2.78 billion by 2014, growing at a CAGR of 8.3% from 2009 to 2014. The North American market is expected to account for nearly 65% of the total revenues.

Additional Detail Regarding TSMC Expects Next Year to be a Record Year

HSINCHU, Taiwan, R.O.C. -

At TSMC’s third quarter investors’ conference on October 29, TSMC Chairman Dr. Morris Chang commented that “For TSMC, we expect next year to be a record year.” TSMC Spokesperson and Chief Financial Officer Ms. Lora Ho provides additional detail regarding this statement.

NXP Semiconductors Announces Live Webinar: Lowest Power 32-Bit Cortex M-Series Microcontrollers for Portable and Industrial Applications

SAN JOSE, California -

NXP Semiconductors announces the following TechOnline Webinar:

What: NXP Semiconductors Webinar

Webinar Alert: Tensilica Announces The Five Pitfalls of 4G Baseband SOC Design

SANTA CLARA, California -

Tensilica announces the following TechOnline Webinar:

What: The Five Pitfalls of 4G Baseband SOC Design Webinar When: Tuesday, October 27, 2009 @ 11 am PT / 2 pm ET Where: seminar2.techonline.com/registration/distrib.cgi?s=1441&d=3329 How: Live over the Internet — Simply log on to the web at the address above.

Marvell Launches ARMADA — New Application Processors for Next Generation Mobile Computing and Intelligent Connected Devices

SANTA CLARA, California -

- Breakthrough for Consumers: Marvell’s High Performance, Low Power Application Processors Deliver Immersive Multimedia and Seamless Internet Connectivity Optimized for Multiple Software Standards

Webinar Alert: Real Time Clocks and the Advantages of Using a Stand-alone Version From NXP Semiconductors

SAN JOSE, California -

NXP Semiconductors announces the following TechOnline Webinar:

What: Webinar: Real Time Clocks and the advantages of using a stand-alone version from NXP Semiconductors When: Thursday, October 22, 2009, 11:00am EDT (8:00am PDT, 15:00 GMT) Where: seminar2.techonline.com/registration/distrib.cgi?s=1432&d=2958 How: Live over the Internet — Simply log on to the web at the address above. Contact: Rebecca Samuel, Media Relations, NXP Semiconductors, +1-408-474-8769

Icera Continues to Grow Mobile Broadband Revenues in Q3 2009

BRISTOL, England -

- Fifth Successive Quarter of Growth for Private Semiconductor Company

Melexis Opens the Door on a New World of Automotive High Voltage Integration

YPRES, Belgium - Melexis extends its product portfolio of ASSPs with a new generation of system solutions for different smart actuator applications, like window lifter, roof control, engine flaps as well as seatbelt retractors and others. The MLX81150, developed with the industries most cost efficient 0.18um technology, realizes the single die integration of automotive grade high voltage components, flash memory as well as digital and mixed signal blocks.

Atmel Appoints Joerg Strughold as Vice President of European Sales

SAN JOSE, California -

- Industry executive brings 15 years of leadership and sales experience to the European marketplace

Atmel Launches Industry’s Safest Battery Management Solution for Automotive and Industrial High-Cell-Count Li-Ion Battery Packs

SAN JOSE, California -

- Devices enable cost savings of up to 60 percent compared to existing solutions

Trident Microsystems and NXP to Combine Digital TV and Set-Top Box Businesses to Create Industry Leader in the Digital Home Market

SANTA CLARA, California and EINDHOVEN, Netherlands -

Trident Microsystems, Inc. (Nasdaq: TRID) and NXP Semiconductors today announced that they have signed a definitive agreement whereby Trident will acquire NXP’s television systems and set-top box business lines. Trident would remain fabless with a significant presence in Asia and as a result of the transaction would have a global leadership position in the digital home entertainment market. Under the terms of the transaction, NXP will receive newly issued shares of Trident common stock equal to 60% of the total shares outstanding post-closing, including approximately 6.7 million shares that NXP will purchase at a price of US$4.50 per share, resulting in cash proceeds to Trident of US$30 million.

Semicon Europa: FRT Introduces Ultra High Aspect-Ratio Measurements for Through-Silicon Vias (TSV) in 3D Wafer Packaging

BERGISCH GLADBACH, Germany - At this year’s Semicon Europa 2009, FRT again presents innovative wafer metrology solutions for R&D and process control tasks in MEMS, semiconductor, and photovoltaic production. A selection of FRT’s products can be viewed and tried for test measurements in hall 3, booth 101 at Semicon Europa in Dresden from October 6th to 8th 2009.

TC Interconnect Announces Arrangement with Dongfang to Manufacture and Market of LED Road Lamps to Tap 48 Million LED Road Lamp Market in China

HONG KONG -

TC Interconnect Holdings Limited (SEHK Code: 0515) (”TC Interconnect”/ the “Group”), one of the top 10 Printed Circuit Board (PCB) manufacturers in Hong Kong and China, today announces that the Group is having a partnership with LED lighting technology proprietary developer and operator Orient Opto — Semiconductors Corp. (”Dongfang”) to engage the design and manufacture of Light Emitting Diode (LED) lighting as well as operation and management of energy saving projects such as LED road lamp via business model of Energy Management Contract (EMC)(Note 1).

Green Latch Enables Great Power-Saving for Contact-Less Magnetic Scrolling Applications

IEPER, Belgium - Melexis announces today the release of the MLX92213. This newly designed low voltage Hall-Effect Latch sensor integrates advanced power management providing micropower-efficient solutions for battery or handheld applications. With its ingenious magnetic design, the MLX92213 offers a breakthrough contact-less and reliable solid-state solution for incremental rotary encoders. The device enhances the efficiency and power consumption of all scrolling or trackball-type applications found in computer peripherals, mobile phones or other handheld consumer electronics.

Honeywell Launches New Material to Improve Efficiency, Power Output of Solar Panels

MORRIS TOWNSHIP, New Jersey -

- Anti-reflective coating for glass improves light transmittance

Frost & Sullivan Commends Cryptography Research for Technology Leadership

LONDON -

Cryptography Research, Inc. has been conferred the Frost & Sullivan “2009 World Smart Card Technology Leadership of the Year Award,” for its outstanding overall performance including excellence in technology innovation, business development, formulation of a competitive strategy, and industry adoption rates.

Advanced Energy(R) Introduces a European Version of Solaron(R) 500 kW Photovoltaic Inverter

FORT COLLINS, Colorado -

- Backed by nearly 30 years of experience perfecting power conversion solutions, Solaron(R) inverters enable customers to achieve the lowest levelized cost of energy (LCOE)

Marvell and NuTune Collaborate on New Hybrid NIM for European Integrated Digital Television Sets

BERLIN -

- Marvell’s turnkey hybrid demodulator offers manufacturers the opportunity to develop low profile, low power, cost-effective products for the iDTV market.

Marvell Debuts Family of Single Chip Hybrid Demodulators for Integrated Digital Televisions

BERLIN -

- Marvell 88DE8020 demodulates DVB-T, DVB-C, NTSC/PAL/SECAM signals from terrestrial and cable networks.

Internet Evolution Welcomes Andrew Keen to IE Radio Today

NEW YORK -

- Silicon Valley author and media critic to weigh in on the future of online content and the relative value of Web 2.0 tools for individuals and businesses

Progress on Scale Up Production of 3″ SiC Wafer by TankeBlue

BEIJING -

TankeBlue Semiconductor Co. Ltd., a pioneer in the SiC industry of the Asia-pacific region, has recently scaled-up production of high quality 3″ SiC wafers. Early this year, TankeBlue lowered its 2″ wafers’ price to a record level in response to the increasing market demands of SiC customers worldwide. Currently, it can supply, in lager scale, conductive n-type 3″ 4H-SiC wafers with a micro-pipe density below 10 cm-2, a key quality parameter for applications. The other key quality parameters, such as the resistivity (less than 0.03 ohm.cm), the full width at the half maximum (FWHM: 30 arcsec) of X-ray rocking curve, of the 3″ 4H-SiC wafer also make the wafer quality very competitive compared to other suppliers from the United States and Europe. In addition, the wafer processing quality of the SiC wafers is proven to be epi-ready, excellent for growth of GaN and/or SiC epi-layers on the SiC wafer. The SiC devices, such as the Schottky barrier diode, metal semiconductor / oxide field effect transistor, processed on the wafer by customers, have demonstrated high performance comparable with those on SiC wafers from other suppliers. It is clear that this makes TankeBlue a new supply source of 3″ SiC wafers and, surely, it is a welcome move for the worldwide SiC semiconductor community.

Melexis and BFi OPTiLAS Partner on European Distribution of Wireless Integrated Circuits

YPRES, Belgium - Melexis, a leading supplier of mixed signal semiconductors, announces that French based BFi OPTiLAS will join its’ sales network as a distributor for the company’s Wireless ICs in Europe. Melexis RF product portfolio includes ISM band transmitters, receivers and transceivers along with RFID and wireless sensor tags.

Webinar Alert: NXP Semiconductors Announces Live Webinar: Achieve Higher Performance In Your Wireless System Designs

SAN JOSE, California -

NXP Semiconductors announces the following TechOnline Webinar:

What: NXP Semiconductors Webinar When: Tuesday, September 1, 2009, 11:00am EDT (8:00am PDT, 15:00 GMT) Where: seminar2.techonline.com/registration/distrib.cgi?s=1414&d=2958 How: Live over the Internet — Simply log on to the web at the address above. Contact: Rebecca Samuel, Media Relations, NXP Semiconductors, +1-408-474-8769

TSMC Adds High-K Metal Gate Low Power Process to 28nm Road Map

HSINCHU, Taiwan, R.O.C. -

- Risk production expected in Q3 2010

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010.

TSMC Achieves 28nm SRAM Yield Breakthrough

HSINCHU, Taiwan, R.O.C. -

- Key process development achievement demonstrates gate-last approach manufacturing benefits

Supermicro Ships 6Gb/s SAS 2.0 Solutions

SAN JOSE, California -

- Raising the Bar in Enterprise Storage Performance with Comprehensive SAS 2.0 Server, Workstation and Blade Product Lines

University of Southampton Receives Charles Babbage Grant from Synopsys

MOUNTAIN VIEW, California -

- First Western European recipient to establish new lab dedicated to advanced SoC design

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